Contributing to improvements in semiconductor backend processes! *February event, Kyoto Business Exchange Fair
Exhibiting products related to peripheral tools in semiconductor back-end processes, such as die bonding and wire bonding!
Orte Corporation Co., Ltd. will be exhibiting at the Kyoto Business Exchange Fair held from February 18 (Wednesday) to 19 (Thursday), 2026. We invite you to have direct discussions with our experts regarding improvement measures in the semiconductor backend process, and take this opportunity to obtain the latest information on collets and tools related to the backend process. If you are interested in the latest industry trends and innovative solutions, please stop by our booth. We sincerely look forward to your visit. [Exhibition Contents] - Pickup collets (rubber/resin/metal/others) - Bonding-related components (upward needles, dispense nozzles, transfer pins) - Wire bonding-related components (EFO torch, wire clampers, window clampers, finger clamps) - Transport components (magazine racks, IC chip trays) *Please refer to our related catalog for the products we handle.
- Company：オルテコーポレーション 本社
- Price：Other
